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Category: Autodesk
Category: Windows software
Category: 3D graphics software
Category: Dimensional modelingThe subject matter of the present application relates to microelectronic packages and assemblies incorporating microelectronic packages.
Semiconductor chips or wafers, collectively referred to as “chips” are widely used in various applications. Chips are usually packaged in a “package” or “package body” to provide physical protection and/or to enhance electrical performance. For example, one or more chips may be packaged together in a multichip module. A multichip module (MCM) is an integrated circuit (IC) package that includes more than one chip. Further, an MCM may incorporate more than one type of chip, such as memory, microprocessor, application specific IC (ASIC) chips, etc.
Some chips or other components of an MCM may generate a substantial amount of heat, particularly at high clock speeds. For example, a microprocessor is often capable of operating at a clock frequency of more than 1 GHz. As the heat dissipated by such a microprocessor increases, the microprocessor may have reduced operating life and/or may be prone to premature failure.
Moreover, heat generated by an MCM may be trapped in the MCM. The heat trapped in the MCM may negatively impact the performance of other chips in the MCM. For example, the heat generated by one chip may cause an adjacent chip to operate at an increased temperature. Further, the heat generated by one chip of an MCM may not dissipate efficiently. For example, heat may be transferred from the chip to the package containing the chip.
A variety of techniques have been used to enhance heat transfer from a chip or other component. For example, one or more heat spreaders or “spreaders” may be provided. Each spreader may be configured to spread heat from a chip or other component to the ac619d1d87
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